Specific Process Knowledge/Etch/ICP Metal Etcher/silicon oxide/By Peixiong/images CF4: Difference between revisions
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image:10mm from wf edge_089.jpg|wafer edge | image:10mm from wf edge_089.jpg|wafer edge | ||
image:10mm from wf edge_090.jpg|wafer edge | image:10mm from wf edge_090.jpg|wafer edge | ||
image:10mm from wf edge_091.jpg|wafer edge | image:10mm from wf edge_091.jpg|Position of the scanning: wafer edge | ||
image:10mm from wf edge_092.jpg|wafer edge | image:10mm from wf edge_092.jpg|wafer edge | ||
image:10mm from wf edge_093.jpg|wafer edge | image:10mm from wf edge_093.jpg|wafer edge | ||
Revision as of 09:36, 28 January 2019
Images stepper_6A1_feb262013_step9
- 6A1_feb262013_step9
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Images stepper_6A4_feb262013_step9
- 6A4_feb262013_step9
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wafer edge -
wafer edge -
wafer edge -
wafer edge -
Position of the scanning: wafer edge -
wafer edge -
wafer edge -
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wafer center -
wafer center -
wafer center -
wafer center
Images Stepper_6A5_feb272013
- 6A5_feb262013 step9 and step10
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Wafer edge -
Wafer edge -
Wafer edge -
Wafer edge -
Wafer edge -
Wafer edge -
Wafer center -
Wafer center -
Wafer center -
Wafer center -
Wafer center -
Top view -
Top view -
Top view -
Top view -
Top view -
Top view
images 3
- 6A1_feb262013_step9