Specific Process Knowledge/Characterization/SEM Supra 1: Difference between revisions

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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>SEM LEO (Leo 1550 SEM)</b>
|style="background:WhiteSmoke; color:black"|<b>SEM Supra 1 (Supra 40VP SEM)</b>
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Purpose
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Purpose
|style="background:LightGrey; color:black"|Imaging and measurement of
|style="background:LightGrey; color:black"|Imaging and measurement of
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Any (semi)conducting sample that may have thin (> ~ 5 µm) layers of non-conducting materials on top
*Any sample except bulk insulators such as polymers, glass or quartz wafers
|-
|style="background:LightGrey; color:black"|Other purpose
|style="background:WhiteSmoke; color:black"|
*E-beam lithography using Raith Elphy Quantum system
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Location  
!style="background:silver; color:black;" align="center" width="60"|Location  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Cleanroom of DTU Danchip
*Basement of DTU Danchip
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|Resolution
|style="background:LightGrey; color:black"|Resolution
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*~ 5 nm (limited by vibrations)
*1-2 nm (limited by vibrations)
The resolution is strongly dependent on the type of sample and the skills of the operator.
The resolution is strongly dependent on the type of sample and the skills of the operator.
|-
|-
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*Secondary electron (Se2)
*Secondary electron (Se2)
*Inlens secondary electron (Inlens)
*Inlens secondary electron (Inlens)
*Backscatter electron (BSD)
*4 Quadrant Backscatter electron (QBSD)
*Variable pressure secondary electron (VPSE)
|-
|-
|style="background:LightGrey; color:black"|Stage
|style="background:LightGrey; color:black"|Stage
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*X, Y: 125 &times; 100 mm
*X, Y: 130 &times; 130 mm
*T: 0 to 90<sup>o</sup>
*T: -4 to 70<sup>o</sup>
*R: 360<sup>o</sup>
*R: 360<sup>o</sup>
*Z: 48 mm
*Z: 50 mm
|-
|-
|style="background:LightGrey; color:black"|Electron source
|style="background:LightGrey; color:black"|Electron source
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|style="background:LightGrey; color:black"|Operating pressures
|style="background:LightGrey; color:black"|Operating pressures
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Fixed at High vacuum (2 &times; 10<sup>-5</sup>mbar - 10<sup>-6</sup>mbar)
*Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
*Variable at Low vacuum (0.1 mbar - 2 mbar)
|-
|-
|style="background:LightGrey; color:black"|Options
|style="background:LightGrey; color:black"|Options
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Raith Elphy Quantum E-Beam Litography system
*All software options available
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 100 mm wafer
*Up to 6" wafer with full view  
*1 150 mm wafer (not full view)
*Smaller samples
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Any standard cleanroom materials.
*Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
|-  
|-  
|}
|}

Revision as of 09:17, 2 May 2016

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The SEM Supra 1

SEM LEO

The SEM LEO

The SEM LEO is a scanning electron microscope. It is a very reliable and rugged instrument that provides high quality SEM images of most samples, and it has excellently served the users of the cleanroom for many years. Excellent images on a large variety of materials such as semiconductors, semiconductor oxides or nitrides, metals, thin films and some polymers may be acquired on the SEM.

However, the SEM LEO has now been equipped with a Raith e-beam lithography system, and from the turn of the year 2015-2016 it is exclusively dedicated to the users of the Raith E-beam lithography, so system so general imaging of user samples is no longer allowed.

The SEM LEO was installed in the cleanroom in the 1998, and the software was ungraded in 2012.


The user manual, control instruction, the user APV and contact information can be found in LabManager:

SEM LEO info page in LabManager,


Performance information

Equipment performance and process related parameters

Equipment SEM Supra 1 (Supra 40VP SEM)
Purpose Imaging and measurement of
  • Any sample except bulk insulators such as polymers, glass or quartz wafers
Location
  • Basement of DTU Danchip
Performance Resolution
  • 1-2 nm (limited by vibrations)

The resolution is strongly dependent on the type of sample and the skills of the operator.

Instrument specifics Detectors
  • Secondary electron (Se2)
  • Inlens secondary electron (Inlens)
  • 4 Quadrant Backscatter electron (QBSD)
  • Variable pressure secondary electron (VPSE)
Stage
  • X, Y: 130 × 130 mm
  • T: -4 to 70o
  • R: 360o
  • Z: 50 mm
Electron source
  • FEG (Field Emission Gun) source
Operating pressures
  • Fixed at High vacuum (2 × 10-4mbar - 10-6mbar)
  • Variable at Low vacuum (0.1 mbar - 2 mbar)
Options
  • All software options available
Substrates Batch size
  • Up to 6" wafer with full view
Allowed materials
  • Any standard cleanroom material and samples from the Laser Micromachining tool and the Polymer Injection Molding tool
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