Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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==Process information== | ==Process information== | ||
[[Image:140 250 nm tilt22 (1).jpg|350x350px|right|thumb|The SEM picture of 250nm pillors and lines. Exposure dose is 140 J/m2.]] | [[Image:140 250 nm tilt22 (1).jpg|350x350px|right|thumb|The SEM picture of 250nm pillors and lines. Exposure dose is 140 J/m2.]] | ||
The | The spinning process will be performed by the customer together with the Photolith group of Danchip. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you. | ||
We have observed that using automatic developing we can decrease the exposure dose for resolve the 250nm pillors structures comparing to dose needed for resolve the line the same size. | We have observed that using automatic developing we can decrease the exposure dose for resolve the 250nm pillors structures comparing to dose needed for resolve the line the same size. | ||