Specific Process Knowledge/Lithography: Difference between revisions

@@ Line 322: / Line 322: @@
 '''<big>Manuals</big>'''
-*Automatic Spin Coater:
+*Automatic Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 Spin Coater: Gamma UV]
-*Manual Spin Coater:
+*Manual Spin Coater: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=331 Spin Coater: Manual Standard Resists]
-*UV Mask Aligner:
+*UV Mask Aligner: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=339 Aligner: MA6 - 2] or [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 KS Aligner]
-*Automatic Puddle Developer:
+*Automatic Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=329 Developer: TMAH UV-lithography]
-*Manual Puddle Developer:
+*Manual Puddle Developer: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 Developer: TMAH Manual]