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Specific Process Knowledge/Lithography/UVLithography: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,531 edits
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|For process with resist thickness between 6 and 25 µm.  
|For process with resist thickness between 6 and 25 µm.  
|[[media:AZ4500.pdf‎|AZ4500.pdf‎]]
|[[media:AZ4500.pdf‎|AZ4500.pdf‎]]
|[[Specific_Process_Knowledge/Lithography/Coaters#SSE Spinner|SSE]],
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|A manual spin coater]] or
 
[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|A manual spin coater]] or


[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]]
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