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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/SEM:_Scanning_Electron_Microscopy  click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/SEM:_Scanning_Electron_Microscopy  click here]'''  


[[image:SEM-Leo.jpg|200x200px|right|thumb|The Leo SEM]]
[[image:SEM-Leo.jpg|200x200px|right|thumb|The Leo SEM]]
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== Scanning electron microscopy at Danchip==
== Scanning electron microscopy at Danchip==


The SEM's at Danchip cover a wide range of needs both in the cleanroom and outside: From the fast in-process verification of different process parameters such as etch rates, step coverages or lift-off quality to the ultra high resolution images on any type of sample intended for publication. They are all manufactured by Carl Zeiss and have the same graphical user interface.
At Danchip there a four SEMs (scanning electron microscopes) that all cover a wide range of needs both in the cleanroom and outside: From the fast in-process verification of different process parameters such as etch rates, step coverages or lift-off quality to the ultra high resolution images on any type of sample intended for publication.  
 
All four SEMs all manufactured by Carl Zeiss and have the same graphical user interface and very identical electron optics.
 
Three SEMs are located in the cleanroom (SEM Supra 2, SEM Supra 3 and SEM LEO), and one SEM is located in the basement (SEM Supra 1).  


At the turn of the year 2015-2016 we made a reorganisation of the SEM's at Danchip. The old workhorse SEM's (the Leo and Zeiss) that have excellently served the users of the cleanroom for many years will be given new roles.
At the turn of the year 2015-2016 we made a reorganisation of the SEM's at Danchip. The old workhorse SEM's (the LEO and Supra 1) that have excellently served the users of the cleanroom for many years will be given new roles:


* The Leo SEM is a very reliable and rugged instrument that provides high quality images of most samples. It is exclusively dedicated to the users of the Raith E-beam lithography system so general imaging of user samples is no longer allowed.  
* The Leo SEM is a very reliable and rugged instrument that provides high quality images of most samples. It is exclusively dedicated to the users of the Raith E-beam lithography system so general imaging of user samples is no longer allowed.  
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|style="background:WhiteSmoke; color:black" align="center"|[[/Supra2|SEM Supra 2]]
|style="background:WhiteSmoke; color:black" align="center"|[[/Supra2|SEM Supra 2]]
|style="background:WhiteSmoke; color:black" align="center"|[[/Supra3|SEM Supra 3]]
|style="background:WhiteSmoke; color:black" align="center"|[[/Supra3|SEM Supra 3]]
|style="background:WhiteSmoke; color:black" align="center"|[[Specific Process Knowledge/Characterization/SEM FEI QUANTA 200 3D|FEI Quanta 200 3D]]
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Model  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Model  
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|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 60 VP
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 60 VP
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 40 VP
|style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 40 VP
|style="background:WhiteSmoke; color:black" align="center"| FEI Quanta 200 3D
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!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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* Samples from the 'real' world outside the lab
* Samples from the 'real' world outside the lab
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* Conductive samples
* Conductive samples-->
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!style="background:silver; color:black;" align="center" width="60"|Instrument Position
!style="background:silver; color:black;" align="center" width="60"|Instrument Position
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*Cleanroom of DTU Danchip
*Cleanroom of DTU Danchip
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*DTU CEN
*DTU CEN-->


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* 20 nm (limited by instrument)
* 20 nm (limited by instrument)
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* ~3.5 nm (limited by instrument)
* ~3.5 nm (limited by instrument)-->
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!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Instrument specifics
!style="background:silver; color:black" align="center" valign="center" rowspan="5"|Instrument specifics
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* Secondary electron (SEI)
* Secondary electron (SEI)
* Backscatter electron (BEI)
* Backscatter electron (BEI)
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* Secondary electron (Everhart-Thornley (ETD))
* Secondary electron (Everhart-Thornley (ETD))
* Backscatter electron (BSD) - Add-on
* Backscatter electron (BSD) - Add-on
* Large Field Detector (LFD) - Add-on
* Large Field Detector (LFD) - Add-on
* CCD camera  
* CCD camera -->
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|style="background:LightGrey; color:black"|Stage
|style="background:LightGrey; color:black"|Stage
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* R: 360<sup>o</sup>  
* R: 360<sup>o</sup>  
* Z: 38 mm
* Z: 38 mm
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* X, Y: 25 &times; 25 mm
* X, Y: 25 &times; 25 mm
* T: 0 to 60<sup>o</sup>  
* T: 0 to 60<sup>o</sup>  
* R: 360<sup>o</sup>
* R: 360<sup>o</sup>-->
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|style="background:LightGrey; color:black"|Electron source
|style="background:LightGrey; color:black"|Electron source
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* Tungsten filament
* Tungsten filament
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* Tungsten filament
* Tungsten filament-->
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|style="background:LightGrey; color:black"|Operating pressures
|style="background:LightGrey; color:black"|Operating pressures
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* Fixed at High vacuum
* Fixed at High vacuum
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* High vacuum and Low vacuum
* High vacuum and Low vacuum-->
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|style="background:LightGrey; color:black"|Options
|style="background:LightGrey; color:black"|Options
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* Oxford Instruments X-Max<sup>N</sup> 50 mm<sup>2</sup> SDD EDX detector and AZtec software package
* Oxford Instruments X-Max<sup>N</sup> 50 mm<sup>2</sup> SDD EDX detector and AZtec software package
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* Focused ion beam (FIB) (Ga<sup>+</sup> ions)
* Focused ion beam (FIB) (Ga<sup>+</sup> ions)-->
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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* Up to 4" wafer
* Up to 4" wafer
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* Wafers won´t fit without a proper holder. The height of the sample is critical, should be as small, as possible
* Wafers won´t fit without a proper holder. The height of the sample is critical, should be as small, as possible-->
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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* Any standard cleanroom material including graphene or CNT samples
* Any standard cleanroom material including graphene or CNT samples
* Biological samples
* Biological samples
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* Conductive materials
* Conductive materials
* No biological samples
* No biological samples-->
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