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Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

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|'''General description'''
|'''General description'''
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It is used for removal of light organics, particles and metal.
Used for removal of light organics, particles and desorption of trace metals (Au, Ag, Ni, Cd, Zn, Co, Cr, etc).
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It is used for removal of heavy metals, alkalies and metal hydroxides.
Used for removal of alkali ions, metal hydroxides (of Al, Fe, Mg, Zn) and residual trace metals (e.g. Cu and Au).
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It is used for removal of oxide generated in RCA1 and RCA2
It is used for removal of oxide generated in RCA1 and RCA2
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