Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

← Older editNewer edit →
VisualWikitext
Paphol (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
912 edits
Paphol (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
912 edits
Line 11: Line 11:
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
Line 19: Line 18:
|E-beam deposition of Chromium
|E-beam deposition of Chromium
|E-beam and sputter deposition of Chromium
|E-beam and sputter deposition of Chromium
|E-beam deposition  of Chromium
|E-beam deposition of Chromium
|E-beam deposition of Chromium
|Sputter deposition of Chromium
|Sputter deposition of Chromium
Line 25: Line 23:
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
Line 35: Line 32:
|10Å to 1µm*
|10Å to 1µm*
|10Å to 1µm*
|10Å to 1µm*
|10Å to 1000 Å
|10Å to 1000 Å
|10Å to 1000 Å
|.
|.
Line 43: Line 39:
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|10Å/s to 15Å/s
|10Å/s to 15Å/s
|About 1Å/s
|10Å/s
|10Å/s
|Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]]
|Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]]
Line 58: Line 53:
*6x4" wafers or
*6x4" wafers or
*6x6" wafers
*6x6" wafers
|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
|
*1x 2" wafer or
*1x 2" wafer or
Line 74: Line 65:
! Allowed substrates
! Allowed substrates
|  
|  
* Silicon wafers
* Quartz wafers
* Pyrex wafers
|
* Silicon wafers  
* Silicon wafers  
* Quartz wafers  
* Quartz wafers  
Line 107: Line 94:
* SU-8  
* SU-8  
* Metals  
* Metals  
|
* Silicon
* Silicon oxide
* Silicon nitride
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
|
|
* Silicon
* Silicon
Line 145: Line 123:
|
|
|
|
|Only very thin layers (up to 100nm).
|
|
|
|
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Chromium"