Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions
| Line 4: | Line 4: | ||
It consists of two solutions: RCA1 and RCA2 plus diluted HF. | It consists of two solutions: RCA1 and RCA2 plus diluted HF. | ||
The RCA1 contains: H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for | The RCA1 contains: H<math>_2</math>O, NH<math>_4</math>OH and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of light organics, particles and metal. <br \> | ||
The RCA2 contains: H<math>_2</math>O, HCl and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of heavy metals, alkalies and metal hydroxides. | The RCA2 contains: H<math>_2</math>O, HCl and H<math>_2</math>O<math>_2</math> (5:1:1). It is used for removal of heavy metals, alkalies and metal hydroxides. | ||