Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
No edit summary |
|||
| Line 111: | Line 111: | ||
|} | |} | ||
[[Image:BHF_wetting.jpg|300x300px|thumb|SIO etch (BHF with wetting agent): positioned in cleanroom 4]] | [[Image:BHF_wetting.jpg|300x300px|thumb|SIO etch (BHF with wetting agent): positioned in cleanroom 4]] | ||
[[Image:KOH_4tommer.jpg|225x225px|thumb|BHF between the KOH baths: positioned in cleanroom 3. This | [[Image:KOH_4tommer.jpg|225x225px|thumb|BHF between the KOH baths: positioned in cleanroom 3. This is primarily used to remove oxide before and after a KOH etch]] | ||
<br clear="all" /> | <br clear="all" /> | ||