Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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== Adhesion of Au on Si == | == Adhesion of Au on Si == | ||
The adhesion of Au on Si is not very good, and an | The adhesion of Au on Si is not very good, and an adhesion layer is often deposited on the wafer, before the Au layer evaporated. A good metal to use as adhesionlayer is Ti, but Cr is also often used. | ||
The most commonly used thickness of the Ti adhesionlayer is 10 nm. Also thinner layers, for example 5 nm, can be used. | The most commonly used thickness of the Ti adhesionlayer is 10 nm. Also thinner layers, for example 5 nm, can be used. | ||