Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions

Revision as of 15:03, 28 February 2008

C4 Furnace Aluminium Anneal

C4 Furnace Anneal is a Tempress horizontal furnace for annealing of silicon wafers with Aluminium.

This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom 2. The furnaces are the cleanest process chambers in the cleanroom. In this furnace it is allowed to enter wafers that contains aluminium. Check the cross contamination chart. If you are in doubt, please ask one from the furnace team.

Process knowledge

Annealing: look at the Annealing page

A rough overview of the performance of Aluminium Anneal furnace and some process related parameters

Purpose	Annealing	Annealing of wafers containing aluminium.
Performance	Film thickness	.
Process parameter range	Process Temperature	400-500 ^oC
.	Process pressure	1 atm
.	Gas flows	N $_{2}$ :? sccm
Substrates	Batch size	1-30 4" wafer (or 2" wafers) per run
.	Substrate material allowed	Silicon wafers (new from the box or RCA cleaned) with layers of silicon oxide or silicon (oxy)nitride (RCA cleaned) Quartz wafers (RCA cleaned) Wafers with aluminium.

@@ Line 23: / Line 23: @@
 |style="background:LightGrey; color:black"|Process Temperature
 |style="background:WhiteSmoke; color:black"|
-*800-1150 <sup>o</sup>C
+*400-500 <sup>o</sup>C
 |-
 |style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Process pressure