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| The process flow for a standard e-beam exposure on CSAR with Al on top can be found here [[media:Process Flow CSAR with Al.docx|Process Flow CSAR with Al]]. | | The process flow for a standard e-beam exposure on CSAR with Al on top can be found here [[media:Process Flow CSAR with Al.docx|Process Flow CSAR with Al]]. |
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| = JEOL JBX-9500FSZ =
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| The machine is located in a class 10 cleanroom (E-2) with tight temperature and moisture control. The room must only be entered when the machines or equipment inside the room is intended to be used.
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| You can read more about electron beam writing in this book published by [http://www.cnf.cornell.edu/cnf_spietoc.html SPIE].
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| '''The user manual, technical information and contact information can be found in LabManager and LabAdviser:'''
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| <!-- remember to remove the type of documents that are not present -->
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| <!-- give the link to the equipment info page in LabManager: -->
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| # [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=292 E-beam writer in LabManager]
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| # [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual|User manual for JBX-9500 e-beam writer on LabAdviser]]
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| # [[Specific_Process_Knowledge/Lithography/EBeamLithography/BEAMER|BEAMER Manual on LabAdviser]]
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| # [[Specific_Process_Knowledge/Lithography/EBeamLithography/FilePreparation|Sdf- and jdf file preparation manual on LabAdviser]]
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| == Getting started ==
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| <span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography#top|Go to top of this page]]</span>
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| [[Image:Conversion.png|600px|right|]]
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| To request for an e-beam training session, contact [mailto:e-beam@danchip.dtu.dk e-beam@danchip.dtu.dk]; a DTU Danchip personnel will hereafter provide a time slot. Users require '''at least 4 training sessions''' before being allowed full acccess to the machine. The first training will focus on file preparation and compilation alone.
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| '''It takes several months to get full authorization to the machine. Therefore, if you are either in a hurry, or a visiting researcher, or only require a few e-beam exposures to fulfill your project, let one of your authorized colleagues expose for you.'''
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| Before you request for a training on the machine, fulfill the following steps:
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| '''Prepare a v30-file:'''
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| # Prepare your pattern using a layout software (L-edit, CleWin, CAD) and export that to GDS format. Check your GDS-file by importing it in e.g. <span class="plainlinks">[http://www.wieweb.com/ns6/index.html CleWin]</span> or L-edit. In order to reach the files from the computers inside the cleanroom it is recommended to either dropbox them or send them per email to yourself.
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| # Convert the GDS file to v30 using BEAMER; a manual for BEAMER software is found [[Specific_Process_Knowledge/Lithography/EBeamLithography/BEAMER|here]]
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| '''Create sdf and jdf-files:'''
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| #download [http://download.cnet.com/SuperEdi/3000-2352_4-10291091.html SuperEdi],
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| #read the sdf and jdf-file manual found [[Specific_Process_Knowledge/Lithography/EBeamLithography/FilePreparation|here]],
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| #find templates of sdf and jdf files on the cleanroom drive in the folder E-beam sdf and jdf templates.
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| ''' Gather Experience '''
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| #Assist a fully trained colleague of yours when she or he e-beam writes, gather as much knowledge about your e-beam run, i.e. which e-beam current, aperture and dose to use, which shot pitch (e.g. SHOT A,10).
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| # Study the logbook for the e-beam writer: sheet 1 gives you an overview of which condition files (currents and apertures) have been in use recently by which user on which type of resist. On sheet 2 in this logbook you can find a writing time estimation program.
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| # Study the manual for the machine, it can be found [[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual|here]]
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| ''' Prepare a process flow'''
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| #Describe your entire process in a process flow. The process flow should include all information such as type and thickness of resist, size and type of substrate, which processes are to be done before and after e-beam writing. Find process flow templates [[Specific_Process_Knowledge/Lithography/EBeamLithography#E-beam_resists_and_Process_Flows | here]]. '''Attach your process flow to your request for training.'''
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| <br clear="all" />
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| == General Rules ==
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| For safety reasons, even fully trained users are only authorized to mount substrates into the e-beam cassettes, but not authorized to load the cassettes into the autoloader.
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| To use the e-beam writer, book the machine via LabManager, '''note the number and type of substrate as well as the condition file to be used in the 'Public Comment:' field in LabManager'''. Mount your substrate in the cassette and pre-align if necessary. Call for help from DTU Danchip staff to load your cassette into the robot loader (the autoloader).
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| After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and re-load an '''empty''' cassette into the autoloader.
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| If you are unable to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates.
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| == Cassettes ==
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| Authorized users are allowed to unload a cassette from the robot loader (autoloader) and mount their substrate but '''not''' allowed to load the cassette into the loader after mount.
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| We have one chip cassette, 2 2" cassettes, 2 4" cassettes, many 6" cassettes and 1 8" cassette. Some cassettes are made of Aluminum, others of Titanium. The thermal expansion coefficient of Ti is much lower than of Al; bear this in mind if you have crucial patterns to expose.
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| '''Keep''' an eye on the wafer orientation when you mount; the 2" aluminum cassette still have wafer orientation flat-up.
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| {| cellpadding="2" style="border: 2px solid darkgray;" align="right"
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| ! width="250" |
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| ! width="250" |
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| ! width="250" |
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| ! width="250" |
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| ! width="250" |
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| |- border="0"
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| | [[File:IMG_0239.jpg|150px]]
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| |[[File:IMG_6440.jpg|150px]] [[File:IMG_6441.jpg|150px]]
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| | [[File:IMG_6433.jpg|150px]] [[File:IMG_6434.jpg|150px]]
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| | [[File:IMG_6436.jpg|150px]] [[File:IMG_6437.jpg|150px]]
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| |[[File:IMG_6438.jpg|150px]] [[File:IMG_6439.jpg|150px]]
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| |- align="center"
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| | chip Al/Cu cassette with slot widths of 20 mm, 12 mm, 8 mm and 4 mm || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down
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| |}
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| <br> <br> <br> <br>
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