Specific Process Knowledge/Etch/DryEtchProcessing: Difference between revisions
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= Techniques, hardware and challenges common to all dry etch tools = | = Techniques, hardware and challenges common to all dry etch tools = | ||
Revision as of 10:59, 14 May 2018
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Techniques, hardware and challenges common to all dry etch tools
This page contains information that is common to dry etch instruments.
| Dry etch page | Description |
|---|---|
| Hardware comparison | Comparison of the different hardware setups |
| Using carrier wafer | Processing different sizes of substrates by using a carriers: bonding or not bonding |
| Optical Endpoint System | Using the OES technique to find endpoints and to diagnose plasmas |