Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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 ==Spin Coater: Gamma UV==
-===This section is under construction [[Image:section under construction.jpg|70px]]===
 '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV click here]'''
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 ''[[Specific_Process_Knowledge/Lithography/Coaters#Coaters:_Comparison_Table|Coater comparison table]]''
-SPin Coater: Gamma UV is a Gamma 2M cluster with spin coating, vapour priming, and baking modules.
+Spin Coater: Gamma UV is a Gamma 2M cluster from Süss MicroTec with spin coating, vapour priming, and baking modules. The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".
+The coater is equipped with 3 different resists lines:
+*AZ MiR 701
+*AZ nLOF 2020
+*AZ 5214E
+and
+*1 syringe, which can be used for various resists.
+The processes that are available on the system are developed by Danchip. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.
 '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager]'''