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Specific Process Knowledge/Pattern Design: Difference between revisions

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Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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For E-beam lithography the layout file has to be saved as a DXF
For E-beam lithography the layout file has to be saved as a GDS file that is uploaded to the tools computer.


For laser cutting the layout file has to be saved as a DXF file that is uploaded to the tools computer. For more details see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]].
For laser cutting the layout file has to be saved as a DXF file that is uploaded to the tools computer. For more details see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]].


For UV-lithography and DUV-lithography it is necescary to have a physical masks produced based on the layout file.
For UV-lithography and DUV-lithography it is necescary to have a physical masks produced based on the layout file. The file format has to be CIF og GDS.




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