Specific Process Knowledge/Wafer cleaning/cleaning with HF: Difference between revisions

Revision as of 14:07, 27 February 2008

Is in use during the RCA procedure. These baths must only be used in the RCA procedure or to remove native oxide on new wafers from the box. See the RCA page for further details.

Revision as of 14:05, 27 February 2008 view source BGE (talk \| contribs) Bureaucrats, danchip, Administrators 2,908 edits New page: Is in use during the RCA procedure. These baths must only be used in the RCA procedure or to remove native oxide on new wafers from the box. See the [[Process Knowledge/Wafer cleaning/RCA\|...		Revision as of 14:07, 27 February 2008 view source BGE (talk \| contribs) Bureaucrats, danchip, Administrators 2,908 edits No edit summary Newer edit →
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	Is in use during the RCA procedure. These baths must only be used in the RCA procedure or to remove native oxide on new wafers from the box. See the [[Process Knowledge/Wafer cleaning/RCA\|RCA]] page for further details.		Is in use during the RCA procedure. These baths must only be used in the RCA procedure or to remove native oxide on new wafers from the box. See the [[Specific Process Knowledge/Wafer cleaning/RCA\|RCA]] page for further details.