Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
up to 6" | |||
|- | |- | ||
|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"| | |style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Layers that can't be diced | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *Thick metal (>0.75 mm) | ||
*III-V samples | |||
|- | |- | ||
|} | |} | ||