Jump to content

Specific Process Knowledge/Thin film deposition/PECVD: Difference between revisions

Bghe (talk | contribs)
Bghe (talk | contribs)
Line 114: Line 114:
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-3 4" wafer per run
*1 6" wafer per run
*Or several smaller pieces
*Deposition on one side of the substrate
|
*One 4" wafer per run
*One 4" wafer per run
*One 6" wafer per run
*One 6" wafer per run
*Or several smaler pieces on carrier wafer
*Or several smaller pieces on carrier wafer
*Deposition on one side of the substrate
*Deposition on one side of the substrate


|
 
*1-3 4" wafer per run
*1 6" wafer per run
*Or several smaler pieces
*Deposition on one side of the substrate
|-
|-
| style="background:LightGrey; color:black"|Materials allowed
| style="background:LightGrey; color:black"|Materials allowed