Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions

Bghe (talk | contribs)
Jmli (talk | contribs)
Line 158: Line 158:
=== Experiment ===
=== Experiment ===


A number of wafers are patterned with the [[Specific Process Knowledge/Photolithography/masks/travka|travka masks]] in AZ photoresist or 600 nm oxide. The wafers are then etched (batch recipe with 5 minute TDESC interstep cleans) using two different durations of process A in the DRIE-Pegasus.
A number of wafers are patterned with the [[Specific Process Knowledge/Pattern Design/Travka|Travka mask set]] in AZ photoresist or 600 nm oxide. The wafers are then etched (batch recipe with 5 minute TDESC interstep cleans) using two different durations of process A in the DRIE-Pegasus.


{|
{|