Jump to content

Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

← Older editNewer edit →
VisualWikitext
Hvj (talk | contribs)
danchip
43 edits
Hvj (talk | contribs)
danchip
43 edits
Line 86: Line 86:
|Leave 200 µm uncut. It's possible to cut through the sample.
|Leave 200 µm uncut. It's possible to cut through the sample.
|-valign="top"
|-valign="top"
|'''Max. sample thichness'''
|'''Max. sample thickness'''
|not any limits
|1.5 mm
|not any limits
|2.0 mm
|-valign="top"
|-valign="top"
|'''Index accuracy'''
|'''Index accuracy'''
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw"