Specific Process Knowledge/Thin film deposition: Difference between revisions
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=== Other materials === | === Other materials === | ||
*[[Deposition of Silicon Nitride|Silicon Nitride]] | *[[/Deposition of Silicon Nitride|Silicon Nitride]] | ||
*[[Deposition of Silicon Oxide|Silicon Oxide]] | *[[/Deposition of Silicon Oxide|Silicon Oxide]] | ||
*[[Deposition of PolySilicon|PolySilicon]] | *[[/Deposition of PolySilicon|PolySilicon]] | ||
== Choose deposition equipment == | == Choose deposition equipment == | ||
Revision as of 12:01, 17 October 2007
Choose material to deposit
Metals
- Aluminium
- Nickel
- Titanium
- Gold
Polymers
- SU8
- Antistiction coating
- Topas
- PMMA
Other materials
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Leybold - E-beam evaporator and multiple wafer tool
- Wordentec - Metal evaporator and ?
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- B2 Furnace LPCVD Nitride - Deposition of silicon nitrid
- B3 Furnace LPCVD TEOS - Deposition of silicon oxide
- B4 Furnace LPCVD PolySilicon - Deposition of polysilicon
- MVD - Molecular Vapor Deposition