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Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

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|-valign="top"
|-valign="top"
|'''Recommended feed speed'''
|'''Recommended feed speed'''
|<250 µm (for silicon oxides > ~75nm)
|Up to 5 mm/sec
|20 Å to ~2µm (for silicon oxide)
|Up to 2 mm/sec
|-valign="top"
|-valign="top"
|'''Recommended dice depth'''
|'''Recommended dice depth'''
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