|
|
| Line 746: |
Line 746: |
| 120sec on 120C hot plate | | 120sec on 120C hot plate |
| 120sec on 220C hot plate. (Spinning curve made by Alexandra Lupi <allu@fotonik.dtu.dk>) | | 120sec on 220C hot plate. (Spinning curve made by Alexandra Lupi <allu@fotonik.dtu.dk>) |
|
| |
| === Equipment performance and process related parameters ===
| |
|
| |
| {| border="2" cellspacing="0" cellpadding="2"
| |
|
| |
|
| |
| !style="background:silver; color:black;" align="center" width="60"|Purpose
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black"|
| |
| *Spin coating UV sensative resists
| |
| *Spin coating E-beam resits
| |
| |-
| |
| !style="background:silver; color:black;" align="center" width="60"|Resist
| |
| |style="background:LightGrey; color:black"|
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| * UV sensative resist: AZ5214E, AZMiR701, AZ nLoF 2020
| |
| * E-beam resits: ZEP520A, PMMA, HSQ
| |
| * BCB (bisbenzocyclobutene)
| |
| * Diblock copolymer Poly(styrene-b-methyl methacrylate) P(S-b-PMMA)
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
| |
| |style="background:LightGrey; color:black"|Coating thickness
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| Resist depended see spinning curves for differnt resist
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
| |
| |style="background:LightGrey; color:black"|Spin speed
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| Max. speed: 8000 rpm
| |
| |-
| |
| |style="background:LightGrey; color:black"|Spin acceleration
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 100 - 5000 rpm/s
| |
| |-
| |
| |style="background:LightGrey; color:black"|Hotplate temperature
| |
| |style="background:WhiteSmoke; color:black" align="center"|
| |
| * changeable temperature from 20°-200° for III-V materials
| |
| * changeable temperature from 20°-200° for other materials
| |
| |-
| |
| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
| |
| |style="background:LightGrey; color:black"|Substrate size
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| * 50 mm wafers
| |
| * 100 mm wafers
| |
| * 150 mm wafers
| |
| * small pieces down to 3x3 mm2
| |
| |-
| |
| | style="background:LightGrey; color:black"|Allowed materials
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| All cleanroom materials
| |
|
| |
| |-
| |
| |style="background:LightGrey; color:black"|Batch
| |
| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| |
| 1
| |
| |-
| |
| |}
| |
|
| |
| <br clear="all" />
| |
|
| |
|
| ==Spin Coater: Manual Standard Resists == | | ==Spin Coater: Manual Standard Resists == |
