Specific Process Knowledge/Thin film deposition/Deposition of Aluminium Nitride: Difference between revisions
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== Deposition of Aluminium Nitride == | == Deposition of Aluminium Nitride == | ||
AlN can be deposited by using sputtering method with AlN target or reactive sputtering method with Al target in mixtures of argon and nitrogen. AlN film can be deposited by using | AlN can be deposited by using sputtering method with AlN target or reactive sputtering method with Al target in mixtures of argon and nitrogen. AlN film can be deposited by using the [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker Sputter System]]. | ||
==Only one method at the moment== | ==Only one method at the moment== |
Revision as of 09:51, 19 September 2016
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Deposition of Aluminium Nitride
AlN can be deposited by using sputtering method with AlN target or reactive sputtering method with Al target in mixtures of argon and nitrogen. AlN film can be deposited by using the Lesker Sputter System.
Only one method at the moment
Cryofox PVD co-sputter/evaporation | Sputter System Lesker | |
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