Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
| Line 82: | Line 82: | ||
|20 Å to ~2µm (for silicon oxide) | |20 Å to ~2µm (for silicon oxide) | ||
|-valign="top" | |-valign="top" | ||
|''' | |'''Recommended dice depyh''' | ||
|Very dependent of how good the model fits (if the fit is good it could be within 1% for a single layer) | |Very dependent of how good the model fits (if the fit is good it could be within 1% for a single layer) | ||
|Very dependent of how good the model fits. | |Very dependent of how good the model fits. | ||