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Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,093 edits
Line 65: Line 65:
|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*3-5 mTorr
*3-10 mTorr
|-
|-
|style="background:LightGrey; color:black"|Process Gases
|style="background:LightGrey; color:black"|Process Gases
Line 72: Line 72:
*N<math>_2</math>
*N<math>_2</math>
*O<math>_2</math>
*O<math>_2</math>
*2%O<math>_2</math> in Ar
* mixtures of the above
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
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