Specific Process Knowledge/Etch/III-V RIE/III V RIE ETCHES: Difference between revisions
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There are 3 standard processes: '''BCB_LP''' and '''BCB30LP''' are low pressure (anisotropic) medium power etches for planarization of BCB, while '''BCB100W''' is a high power etch to totally remove thick layers of BCB. | There are 3 standard processes: '''BCB_LP''' and '''BCB30LP''' are low pressure (anisotropic) medium power etches for planarization of BCB, while '''BCB100W''' is a high power etch to totally remove thick layers of BCB. | ||
Other resists (ZEP520A, AZ-resists) can be etched by a O< | Other resists (ZEP520A, AZ-resists) can be etched by a O<sub>2</sub> etch. The standard program is called '''ASH?m''', where the process time is optional. | ||
{| border="1" style="text-align: center; width: 600px; height: 350px;" | {| border="1" style="text-align: center; width: 600px; height: 350px;" | ||