Specific Process Knowledge/Lithography/EBeamLithography/FilePreparation: Difference between revisions
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== Alignment and global mark detection == | == Alignment and global mark detection == | ||
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Alignment of an e-beamed pattern to an existing pattern on wafer or chip (direct writing mode) requires at least two alignment marks, P and Q, preferably positioned in quadrant II and IV of the wafer or chip (the x-coordinate of the global mark Q must be equal to or larger than the x-coordinate of the global mark P). | Alignment of an e-beamed pattern to an existing pattern on wafer or chip (direct writing mode) requires at least two alignment marks, P and Q, preferably positioned in quadrant II and IV of the wafer or chip (the x-coordinate of the global mark Q must be equal to or larger than the x-coordinate of the global mark P). | ||