Specific Process Knowledge/Characterization: Difference between revisions
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'''Optical microscopes''' | '''Optical microscopes''' | ||
*[[/Optical microscope|Optical microscope]] | *[[/Optical microscope|Optical microscope]] | ||
Optical characterization | '''Optical characterization''' | ||
*[[/Optical characterization#Ellipsometer|Ellipsometer]] | *[[/Optical characterization#Ellipsometer|Ellipsometer]] | ||
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | *[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | ||
*[[/Optical characterization#Prism_Coupler|Prism Coupler]] | *[[/Optical characterization#Prism_Coupler|Prism Coupler]] | ||
*[[/PL Mapper|PL mapper - ''Photoluminescence mapper'']] | *[[/PL Mapper|PL mapper - ''Photoluminescence mapper'']] | ||
Element analysis | '''Element analysis''' | ||
*[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]] | *[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]] | ||
*[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]] | *[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]] | ||
'''Various''' | |||
*[[/Drop Shape Analyzer|Drop Shape Analyzer]] | *[[/Drop Shape Analyzer|Drop Shape Analyzer]] | ||
Revision as of 19:59, 7 September 2015
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Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point_Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
SEM's at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S
SEM's at Danchip
AFM
Optical and stylus profilers
Optical microscopes
Optical characterization
Element analysis
Various