Specific Process Knowledge/Characterization: Difference between revisions
| Line 23: | Line 23: | ||
== Choose equipment == | == Choose equipment == | ||
SEM's at CEN | |||
*[[/SEM FEI QUANTA 200 3D|FIB-SEM FEI QUANTA 200 3D]] | *[[/SEM FEI QUANTA 200 3D|FIB-SEM FEI QUANTA 200 3D]] | ||
*[[/Dual Beam FEI Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]] | *[[/Dual Beam FEI Helios Nanolab 600|Dual Beam FEI Helios Nanolab 600]] | ||
| Line 28: | Line 29: | ||
*[[/SEM FEI Quanta 200 ESEM FEG|SEM FEI Quanta 200 ESEM FEG]] | *[[/SEM FEI Quanta 200 ESEM FEG|SEM FEI Quanta 200 ESEM FEG]] | ||
*[[/SEM Inspect S|SEM Inspect S]] | *[[/SEM Inspect S|SEM Inspect S]] | ||
SEM's at Danchip | |||
*[[/SEM: Scanning Electron Microscopy |SEM LEO]] | *[[/SEM: Scanning Electron Microscopy |SEM LEO]] | ||
*[[/SEM: Scanning Electron Microscopy |SEM JEOL]] | *[[/SEM: Scanning Electron Microscopy |SEM JEOL]] | ||
*[[/SEM: Scanning Electron Microscopy |SEM Zeiss]] | *[[/SEM: Scanning Electron Microscopy |SEM Zeiss]] | ||
*[[/SEM: Scanning Electron Microscopy |SEM Zeiss Supra 60 VP]] | *[[/SEM: Scanning Electron Microscopy |SEM Zeiss Supra 60 VP]] | ||
*[[/SEM: Scanning Electron Microscopy |SEM Supra 3]] | |||
*[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']] | *[[/AFM: Atomic Force Microscopy|AFM - ''Atomic Force Microscopy'']] | ||
Optical and stylus profilers | |||
*[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]] | *[[/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]] | ||
*[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] | *[[/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] | ||
| Line 42: | Line 46: | ||
*[[/Optical microscope|Optical microscope]] | *[[/Optical microscope|Optical microscope]] | ||
Optical characterization | |||
*[[/Optical characterization#Ellipsometer|Ellipsometer]] | *[[/Optical characterization#Ellipsometer|Ellipsometer]] | ||
*[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | *[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | ||
*[[/Optical characterization#Prism_Coupler|Prism Coupler]] | *[[/Optical characterization#Prism_Coupler|Prism Coupler]] | ||
*[[/PL Mapper|PL mapper - ''Photoluminescence mapper'']] | *[[/PL Mapper|PL mapper - ''Photoluminescence mapper'']] | ||
Element analysis | |||
*[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]] | *[[/SIMS: Secondary Ion Mass Spectrometry#Atomika_SIMS|Atomika SIMS]] | ||
*[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]] | *[[/XPS#XPS-ThermoScientific|XPS-ThermoScientific ]] | ||
*[[/Drop Shape Analyzer|Drop Shape Analyzer]] | *[[/Drop Shape Analyzer|Drop Shape Analyzer]] | ||
Revision as of 19:54, 7 September 2015
Feedback to this page: click here
Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point_Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
SEM's at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S
SEM's at Danchip
Optical and stylus profilers
Optical characterization
Element analysis