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* In the SAVE window, click 'Acquisition of latest status' and (after the parameters appear in the window) click 'Apply/Save'. Note in the status line that the condition file has been saved.
* In the SAVE window, click 'Acquisition of latest status' and (after the parameters appear in the window) click 'Apply/Save'. Note in the status line that the condition file has been saved.


= Exposure of mgn-files =
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
#Open the exposure program, ‘Exp’, from the EBX Menu.
#Find and load your magazine file: click ‘File/Magazine File’ and choose the magazine file from the location ‘/home/eb0/jeoleb/job/danchip’.
#Check that the name of the desired magazine-file appears in the Magazine filename field, then click ‘Execute’.
#Click ‘YES’ if you agree on the information in the ‘Pattern Writing Execution Check’-window.
Before the exposure starts, some inital calibration will be performed such as CURRNT and HEIMAP. When measuring HEIMAP, the last saved condition of HEIMAP will be used.
After finished exposure, the machine will display whether the exposure succeeded.
= Alignment of wafers or chips =
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
Alignment of wafer or chip requires specific training.
First time you align on a type of wafer marks, you need to optimise the gain settings of the scan. The gain settings will depend on resist thickness, mark type (metal or etch) and substrate type. The gain settings can be found by the subprogram '''ACGRG'''.
When the gain settings are known, you can execute '''SETWFR''' and '''CHIPAL'''.
== AGCRG ==
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
{| cellpadding="2" style="border: 2px solid darkgray;" align="right"
! width="500" |
! width="500" |
|- border="0"
|[[File:AGCRG1.png|400px]]
|[[File:AGCRG2.png|400px]]
|- align="center"
| Open and edit AGCRG, in the program window <br> '''1''' Enter the measured (from pre-aligner output) P mark position <br>'''2''' Click 'RG mark detect condition: Setting' and adjust scan width and position. Use a large scan width (200-600 microns). In 'Scan type' choose 'fine scan', 'box scan' and choose the correct mark (cross or L-shaped). Start with an 'X only' scan. <br>'''3''' Save and execute AGCRG || If the program finds the mark, ask the program to transfer the gain settings to SETWFR P (both rough and fine) or SETWFR Q. Scan again with same settings but choose 'Y only' in the 'RG mark detect conditions'.
|}
'''If the program does not find the mark''', try a larger scan width and execute AGCRG again, and/or try to scan 'Y only' instead.
If the program still does not find the mark you can find it manually using the SEM. Remember to minimise the use of SEM:
*Open the Stage program from EBX menu
*In 'sspvideo' click beam/beam-off
*'Move stage to mark position (setting/movement)
*In 'sspvideo' click 'change/BE SEM'
*open 'adjust' and 'Setting' and start the SEM.
*Find the mark ROUGHLY and turn off the SEM again.
Enter approximate mark position into AGCRG and execute AGCRG again.
<br>
<br>
== SETWFR ==
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
[[File:SETWFR.png|600px]]
Before saving your condition file you should run the sub program 'SETWFR'.
SETWFR will scan your P and Q marks and align the exposure to the position of these.
From the calibration window, click 'SETWFR/Edit parameters'. Fill out the SETWFR parameters.
*Choose measurement mode 'Semi Auto'
*enter the material size and slot number (e.g 4A)
*enter the material center offset (from the pre-alignment) and L-edit coordinates of P mark and Q mark.
*In P-mark rough/fine scan settings, adjust scan settings and enter the width of your marks. Also check the gain settings are ok.
*Repeat point 4 for Q-mark rough/fine
*Click save and execute the program.
Standard gain setting for gold wafer marks or etched marks (5-10 µm deep):
<pre>
BE Coarse gain  1
BE Middle gain 14
WAVE offset    128
BE Fine gain  128
BE offset      2020
</pre>
'''When the subprogram 'SETWFR' has found the P and Q marks'''
When SETWFR executes successfully feedback the 'P mark offset' to the OFFSET in the sdf file and re-compile the mgn-file.
<br clear="all" />
[[File:RoughScan.png|400px|right]]
[[File:RoughScanGain.png|400px|right]]
'''If the program cannot find the marks''', you can either adjust the scan conditions, or gain settings. Also, test SETWFR again with 'OFFSET (P-mark)' from the pre-aligner output.
Find the mark manually and let SETWFR scan the mark to align the sample:
As a last alternative, you can chose to find the mark manually; this is however not recommended.
SETWFR will ask you whether you wish to find the mark manually, click OK.
*In 'sspvideo' click 'change/SEM'
*open 'adjust' and 'Setting' and start the SEM.
*Center the mark ROUGHLY and turn off the SEM again as fast as possible.
* Click to continue the SETWFR scan at your present position
*It might be necessary to repeat the procedure with the Q-mark.
Please note that you should NOT align with the SEM but only roughly center the mark so you are sure the mark will be scanned with your scan settings.
'''If SETWFR still cannot find your marks'''
Unload the cassette, unmount your chip/wafer and remove the resist from your chip/wafer marks. Mount, pre-align and load your sample again and execute the exposure using manual alignment (see procedure in troubleshooting).
<br clear="all" />
== CHIPAL ==
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
[[File:CHIPAL.png|500px]]
Before saving your condition file you should run the sub program 'CHIPAL'.
CHIPAL will scan 1 or 4 of your chip marks and align the exposure to the position of these. Also, if HSWITCH is set to measure height in chip mark positions, the beam will be focused to the (average) height of the substrate near chip marks.
During calibration, CHIPAL can be tested on one chip by the subprogram CHIPAL:
From the calibration window, click 'CHIPAL/Edit parameters'. Fill out the CHIPAL parameters:
*Choose 'mode 1' if you have 1 chip mark per chip or 'mode 4' if you have 4 chip marks per chip
*If 'AGRCG' is executed, the machine will optimise the gain settings before mark detection; this is not recommended. Use instead same gain settings as in SETWFR. If the gain settings need to be adjusted for chip mark detection, use the subprogram 'AGRCG' on your chip mark (see section 7.1)
*Leave 'Height measurement execution', 'HEIGHT' and 'SUBHEI' unmarked.
*Enter the center position of one of your chips in 'Chip center coordinate position'; this position is in wafer coordinate systems.
*Enter chip mark positions of M1-M4 in chip coordinate system, i.e. if you have a chip mark 1 mm x 1 mm from the center of the chip, M1 coordinates are (X,Y)=(1000,1000).
*Save and execute the program.
If the program can not detect your chip marks, change the scan conditions ('RG mark detection condition') and try again.
<br clear="all" />


== Detailed descriptions of subprograms ==
== Detailed descriptions of subprograms ==
Line 701: Line 848:
<br> <br>
<br> <br>


= Exposure of mgn-files =
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
#Open the exposure program, ‘Exp’, from the EBX Menu.
#Find and load your magazine file: click ‘File/Magazine File’ and choose the magazine file from the location ‘/home/eb0/jeoleb/job/danchip’.
#Check that the name of the desired magazine-file appears in the Magazine filename field, then click ‘Execute’.
#Click ‘YES’ if you agree on the information in the ‘Pattern Writing Execution Check’-window.
Before the exposure starts, some inital calibration will be performed such as CURRNT and HEIMAP. When measuring HEIMAP, the last saved condition of HEIMAP will be used.
After finished exposure, the machine will display whether the exposure succeeded.
= Alignment of wafers or chips =
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
Alignment of wafer or chip requires specific training.
First time you align on a type of wafer marks, you need to optimise the gain settings of the scan. The gain settings will depend on resist thickness, mark type (metal or etch) and substrate type. The gain settings can be found by the subprogram '''ACGRG'''.
When the gain settings are known, you can execute '''SETWFR''' and '''CHIPAL'''.
== AGCRG ==
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
{| cellpadding="2" style="border: 2px solid darkgray;" align="right"
! width="500" |
! width="500" |
|- border="0"
|[[File:AGCRG1.png|400px]]
|[[File:AGCRG2.png|400px]]
|- align="center"
| Open and edit AGCRG, in the program window <br> '''1''' Enter the measured (from pre-aligner output) P mark position <br>'''2''' Click 'RG mark detect condition: Setting' and adjust scan width and position. Use a large scan width (200-600 microns). In 'Scan type' choose 'fine scan', 'box scan' and choose the correct mark (cross or L-shaped). Start with an 'X only' scan. <br>'''3''' Save and execute AGCRG || If the program finds the mark, ask the program to transfer the gain settings to SETWFR P (both rough and fine) or SETWFR Q. Scan again with same settings but choose 'Y only' in the 'RG mark detect conditions'.
|}
'''If the program does not find the mark''', try a larger scan width and execute AGCRG again, and/or try to scan 'Y only' instead.
If the program still does not find the mark you can find it manually using the SEM. Remember to minimise the use of SEM:
*Open the Stage program from EBX menu
*In 'sspvideo' click beam/beam-off
*'Move stage to mark position (setting/movement)
*In 'sspvideo' click 'change/BE SEM'
*open 'adjust' and 'Setting' and start the SEM.
*Find the mark ROUGHLY and turn off the SEM again.
Enter approximate mark position into AGCRG and execute AGCRG again.
<br>
<br>
== SETWFR ==
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
[[File:SETWFR.png|600px]]
Before saving your condition file you should run the sub program 'SETWFR'.
SETWFR will scan your P and Q marks and align the exposure to the position of these.
From the calibration window, click 'SETWFR/Edit parameters'. Fill out the SETWFR parameters.
*Choose measurement mode 'Semi Auto'
*enter the material size and slot number (e.g 4A)
*enter the material center offset (from the pre-alignment) and L-edit coordinates of P mark and Q mark.
*In P-mark rough/fine scan settings, adjust scan settings and enter the width of your marks. Also check the gain settings are ok.
*Repeat point 4 for Q-mark rough/fine
*Click save and execute the program.


Standard gain setting for gold wafer marks or etched marks (5-10 µm deep):
<pre>
BE Coarse gain  1
BE Middle gain 14
WAVE offset    128
BE Fine gain  128
BE offset      2020
</pre>
'''When the subprogram 'SETWFR' has found the P and Q marks'''
When SETWFR executes successfully feedback the 'P mark offset' to the OFFSET in the sdf file and re-compile the mgn-file.
<br clear="all" />
[[File:RoughScan.png|400px|right]]
[[File:RoughScanGain.png|400px|right]]
'''If the program cannot find the marks''', you can either adjust the scan conditions, or gain settings. Also, test SETWFR again with 'OFFSET (P-mark)' from the pre-aligner output.
Find the mark manually and let SETWFR scan the mark to align the sample:
As a last alternative, you can chose to find the mark manually; this is however not recommended.
SETWFR will ask you whether you wish to find the mark manually, click OK.
*In 'sspvideo' click 'change/SEM'
*open 'adjust' and 'Setting' and start the SEM.
*Center the mark ROUGHLY and turn off the SEM again as fast as possible.
* Click to continue the SETWFR scan at your present position
*It might be necessary to repeat the procedure with the Q-mark.
Please note that you should NOT align with the SEM but only roughly center the mark so you are sure the mark will be scanned with your scan settings.
'''If SETWFR still cannot find your marks'''
Unload the cassette, unmount your chip/wafer and remove the resist from your chip/wafer marks. Mount, pre-align and load your sample again and execute the exposure using manual alignment (see procedure in troubleshooting).
<br clear="all" />
== CHIPAL ==
<span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#top|Go to top of this page]]</span>
[[File:CHIPAL.png|500px]]
Before saving your condition file you should run the sub program 'CHIPAL'.
CHIPAL will scan 1 or 4 of your chip marks and align the exposure to the position of these. Also, if HSWITCH is set to measure height in chip mark positions, the beam will be focused to the (average) height of the substrate near chip marks.
During calibration, CHIPAL can be tested on one chip by the subprogram CHIPAL:
From the calibration window, click 'CHIPAL/Edit parameters'. Fill out the CHIPAL parameters:
*Choose 'mode 1' if you have 1 chip mark per chip or 'mode 4' if you have 4 chip marks per chip
*If 'AGRCG' is executed, the machine will optimise the gain settings before mark detection; this is not recommended. Use instead same gain settings as in SETWFR. If the gain settings need to be adjusted for chip mark detection, use the subprogram 'AGRCG' on your chip mark (see section 7.1)
*Leave 'Height measurement execution', 'HEIGHT' and 'SUBHEI' unmarked.
*Enter the center position of one of your chips in 'Chip center coordinate position'; this position is in wafer coordinate systems.
*Enter chip mark positions of M1-M4 in chip coordinate system, i.e. if you have a chip mark 1 mm x 1 mm from the center of the chip, M1 coordinates are (X,Y)=(1000,1000).
*Save and execute the program.
If the program can not detect your chip marks, change the scan conditions ('RG mark detection condition') and try again.
<br clear="all" />


= Troubleshooting =
= Troubleshooting =
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