Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions
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!style="background:#ADD8E6; color:Black"|SUBDEFBE | !style="background:#ADD8E6; color:Black"|[[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#SUBDEFBE|SUBDEFBE]] | ||
|Using a BE mark, this subprogram corrects deflection gain and rotation of the secondary (sub) deflector. The system positions the BE mark in the corners of the subfield (which is a 4 x 4 µm2 square) and scans the mark using the sub deflector only. | |Using a BE mark, this subprogram corrects deflection gain and rotation of the secondary (sub) deflector. The system positions the BE mark in the corners of the subfield (which is a 4 x 4 µm2 square) and scans the mark using the sub deflector only. | ||
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!DRIFT | ![[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#DRIFT|DRIFT]] | ||
|This subprograms scans the DRIFT mark. The DRIFT mark can either be a BE mark or an alignment mark on the substrate. By scanning the DRIFT mark during exposure, the machine can positionally adjust the exposed pattern during writing, i.e. positional drift due to cassette heat-up or warm-up during writing can be corrected. This is done by using the the path DRF5M in the jdf-file. | |This subprograms scans the DRIFT mark. The DRIFT mark can either be a BE mark or an alignment mark on the substrate. By scanning the DRIFT mark during exposure, the machine can positionally adjust the exposed pattern during writing, i.e. positional drift due to cassette heat-up or warm-up during writing can be corrected. This is done by using the the path DRF5M in the jdf-file. | ||
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!HEIMAP | ![[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#HEIMAP|HEIMAP]] | ||
|This subprogram measures the height of the substrate to be exposed. The size and workpiece position of the substrate (e.g. 4B) should be entered along with information of desired area to measure height. This area should always be larger than the area of the exposed pattern. The system will focus the beam to the average of the height mesaured in HEIMAP, but '''only''' if you expose in mask writing mode (i.e. no aligning) and execute HEIMAP in your initial calibration (e.g. by using path DRF5M). | |This subprogram measures the height of the substrate to be exposed. The size and workpiece position of the substrate (e.g. 4B) should be entered along with information of desired area to measure height. This area should always be larger than the area of the exposed pattern. The system will focus the beam to the average of the height mesaured in HEIMAP, but '''only''' if you expose in mask writing mode (i.e. no aligning) and execute HEIMAP in your initial calibration (e.g. by using path DRF5M). | ||
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!SETWFR | ![[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#SETWFR|SETWFR]] | ||
|This subprograms scans the global marks of the substrate. You need to enter the theoretical positions of the global marks (in wafer coordinate system) and the offset found during pre-aligning. When SETWFR has succeeded in finding your global marks, it will give you a corrected offset, that should be entered in your sdf-file. | |This subprograms scans the global marks of the substrate. You need to enter the theoretical positions of the global marks (in wafer coordinate system) and the offset found during pre-aligning. When SETWFR has succeeded in finding your global marks, it will give you a corrected offset, that should be entered in your sdf-file. | ||
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!CHIPAL | ![[Specific_Process_Knowledge/Lithography/EBeamLithography/JBX9500Manual#CHIPAL|CHIPAL]] | ||
|This subprogram scan a set of chip marks on the substrate. You need to enter theoretical position of a chip on your wafer (in wafer coordinate systems) and the theoretical positions of the chip marks on that chip (in chip coordinate system). CHIPAL will then scan 1 or 4 chip marks (mode 1 or mode 4). | |This subprogram scan a set of chip marks on the substrate. You need to enter theoretical position of a chip on your wafer (in wafer coordinate systems) and the theoretical positions of the chip marks on that chip (in chip coordinate system). CHIPAL will then scan 1 or 4 chip marks (mode 1 or mode 4). | ||
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