Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing/Acceptance test

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The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie.

Recipe: "vr_dryOx_1000C_120min_150_5Wafer_D1_mit_Inliner_oPurgering.ATV"

Oxidation time: 80 min Oxidation temperature: 1050 ^oC O₂ flow: 1 slm

The oxidation has been done with 150 mm wafer, and with 30 wafers in the furnace.

Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured.

Mask	Resist etch rate [nm/min]	Silicon etch rate [µm/min]					Trench width [µm]					Under etch [µm]					Silicon etch angle [oC]
		2 µm	4 µm	10 µm	50 µm	200 µm	2 µm	4 µm	10 µm	50 µm	200 µm	2 µm	4 µm	10 µm	50 µm	200 µm	2 µm	4 µm	10 µm	50 µm	200 µm
Travka5	67.31	0.6	0.63	0.63	0.62	0.61	2.60	4,91	10.96	51.00	201.90
Travka10	63.94	0.57	0.59	0.59	0.58	0.61	2.32	4.60
Travka20	63.13	0.63	0.63	0.64	0.64	0.59
Travka35	59.63	0.57	0.60	0.61	0.61	0.55
Travka50	57.13	0.47	0.5	0.51	0.51	0.49
Travka65	57.88	0.41	0.41	0.42	0.42	0.43
Travka80	57.56	0.37	0.36	0.37	0.37	0.38
Common	Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers