Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions
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|[[File: | |[[File:DriftParameters.png|400px]] | ||
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|In the DRIFT subprogram window, you can either use the <br> '''1''' BE mark: click 'acquisition of Bottom BE mark' or <br> '''2''' use your own global mark: tick 'rough scan not available' and enter the stage position of your global mark || DRIFT measurements (by PATH DRF5M) during a 7 hour long exposure. The machine will positionally correct for the displacement it observes during exposure, i.e. the maximum pattern displacement is the drift between every measurement point (5 min). || According to this table (provided by JEOL) a global mark (P) can be used as a DRIFT mark in automatic or semi-automatic alignment mode if CHIPAL 0, V1, V4 or S is used. A chip mark can be used as a DRIFT mark in any case where CHIPAL is defined to CHIPAL 1 or CHIPAL 4. | |In the DRIFT subprogram window, you can either use the <br> '''1''' BE mark: click 'acquisition of Bottom BE mark' or <br> '''2''' use your own global mark: tick 'rough scan not available' and enter the stage position of your global mark. Adjust the scan conditions to fit your marks. || DRIFT measurements (by PATH DRF5M) during a 7 hour long exposure. The machine will positionally correct for the displacement it observes during exposure, i.e. the maximum pattern displacement is the drift between every measurement point (5 min). || According to this table (provided by JEOL) a global mark (P) can be used as a DRIFT mark in automatic or semi-automatic alignment mode if CHIPAL 0, V1, V4 or S is used. A chip mark can be used as a DRIFT mark in any case where CHIPAL is defined to CHIPAL 1 or CHIPAL 4. | ||
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