Specific Process Knowledge/Thermal Process/Annealing: Difference between revisions
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==Annealing== | ==Annealing== | ||
At Danchip we have four furnaces and an RTP (Rapid thermal annealing) that can be used annealing: Anneal-Oxide furnace (C1), Anneal-bond furnace (C3), Multipurpose Anneal furnace, Noble furnace and Jipelec RTP. Annealing normally takes place in an N<sub>2</sub> atmosphere, or it can be done in H<sub>2</sub> or a H<sub>2</sub>-N<sub>2</sub> gas mixture in the Multipurpose Anneal furnace. PECVD PBSG glass is annealed in a wet atmosphere which will also oxidize the silicon substrate. | |||
A 20 minutes N<sub>2</sub> annealing step is also included in all recipes on the oxidation furnace, this annealing is done after the oxidation. | |||
==Comparison of the annealing furnaces== | ==Comparison of the annealing furnaces== | ||