Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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** For dry or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ** For dry or wet etch processes, investigate the resist etch rate of your process as this might limit the minimum thickness of your resist. | ||
* '''Substrate pretreatment''': In many processes it is recommended to [[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat or prime]] your wafer before spin-coating. In some [[Specific_Process_Knowledge/Lithography/Coaters spin-coaters]], these pretreatment processes are included in the spin coating of resist. If you use either the '''RCD8, SSE or a manual spin coater''', you should add a pretreatment step prior to spin coating in your process flow. | * '''Substrate pretreatment''': In many processes it is recommended to [[Specific_Process_Knowledge/Lithography/Pretreatment|pretreat or prime]] your wafer before spin-coating. In some [[Specific_Process_Knowledge/Lithography/Coaters|spin-coaters]], these pretreatment processes are included in the spin coating of resist. If you use either the '''RCD8, SSE or a manual spin coater''', you should add a pretreatment step prior to spin coating in your process flow. | ||
* '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication|here]]. | * '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication|here]]. | ||