Specific Process Knowledge/Lithography/UVLithography: Difference between revisions
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::A list of UV lithography resist types available at DTU Danchip can be found [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|here]]. | ::A list of UV lithography resist types available at DTU Danchip can be found [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|here]]. | ||
# '''Thickness of resist''': In general, it is recommended to work with an aspect ratio of ~1, i.e. where the width of the pattern is of same size than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need: | # '''Thickness of resist''': In general, it is recommended to work with an aspect ratio of ~1, i.e. where the width of the pattern is of same size than the thickness of the resist. Furthermore, when you decide for the resist thickness, consider which transfer you need: | ||
#* For lift-off processes, we recommend resist thicknnesses ~5 times larger than the thickness of the metal to be lifted. | #* For [[Specific_Process_Knowledge/Lithography/LiftOff|lift-off]] processes, we recommend resist thicknnesses ~5 times larger than the thickness of the metal to be lifted. | ||
#* For dry or wet etch processes, investiagte the etch rate of resist in your process as this might limit the minimum thickness of your resist. | #* For dry or wet etch processes, investiagte the etch rate of resist in your process as this might limit the minimum thickness of your resist. | ||
# '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication#Mask_Fabrication|here]]. | # '''Mask''': Design and order a photomask for your UV process. A detailed instruction on how to design and order a photomask can be found [[Specific_Process_Knowledge/Lithography/Pattern_Design_and_Mask_Fabrication#Mask_Fabrication|here]]. | ||