Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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 | [[File:Chip example.png|150px]]
 |- align="center"
-| Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer. Positions of global marks are entered in jdf file using wafer coordinate system (flat upward). || Example of chip with 4 chip marks. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0).
+| Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer. Positions of global marks are entered in jdf file using wafer coordinate system. || Example of chip with 4 chip marks. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0).
 |}