Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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| [[File:mark example2.png|100px]] | | [[File:mark example2.png|100px]] | ||
| [[File:GlobalMark.png|120px]] | | [[File:GlobalMark.png|120px]] | ||
| [[File:P Q marks and chip marks.png | | [[File:P Q marks and chip marks.png|250px]] | ||
| [[File:Chip example.png | | [[File:Chip example.png|150px]] | ||
|- align="center" | |- align="center" | ||
| Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer. Positions of global marks are entered in jdf file using wafer coordinate system (flat upward). || Example of chip with 4 chip marks. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0). | | Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer. Positions of global marks are entered in jdf file using wafer coordinate system (flat upward). || Example of chip with 4 chip marks. Position of chip marks are entered in jdf file using chip coordinate system, i.e. center of chip is (0,0). | ||