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Specific Process Knowledge/Lithography/EBeamLithography/JBX9500Manual: Difference between revisions

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== Calibration procedure ==


=== Load and restore a condition file ===
=== Load and restore a condition file ===
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*Load and restore a condition file, click ‘Select condition file...’, choose the file from the list, e.g. ‘0.2nA_ap7’ and click OK. Restore the file by clicking ‘RESTOR/Edit Parameter...’. From the RESTOR window, click ‘Excecute’; the machine will now restore the conditions of the colum, this will take a few minutes. Exit the RESTOR window by clicking ‘Cancel’.
*Load and restore a condition file, click ‘Select condition file...’, choose the file from the list, e.g. ‘0.2nA_ap7’ and click OK. Restore the file by clicking ‘RESTOR/Edit Parameter...’. From the RESTOR window, click ‘Excecute’; the machine will now restore the conditions of the colum, this will take a few minutes. Exit the RESTOR window by clicking ‘Cancel’.


=== CURRNT, INITAE, and INITBE ===   
=== Execute CURRNT, INITAE, and INITBE ===   


*Execute ‘CURRNT’ click ‘CURRNT/Execute’. The program ends by stating the average value of five measurements of the e-beam current; write this average current in the logbook.
*Execute ‘CURRNT’ click ‘CURRNT/Execute’. The program ends by stating the average value of five measurements of the e-beam current; write this average current in the logbook.
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*Execute the pre-defined set of sub-programs called ‘daily’: click 'Commands/Batch...'. Click ‘Condition file...’, choose ‘daily’, and click OK and execute. This set of programs takes around 8-10 minutes to run.
*Execute the pre-defined set of sub-programs called ‘daily’: click 'Commands/Batch...'. Click ‘Condition file...’, choose ‘daily’, and click OK and execute. This set of programs takes around 8-10 minutes to run.
=== Execute DRIFT ===
* Click 'DRIFT' and 'Edit parameters'.
* Select ‘Acquisition of bottom BE mark’, and click ‘Save’ and ‘Execute’. Exit the window by clicking ‘Cancel’.
* If you are calibrating the high current of a double-current exposure you should increase the scan width to 40 microns and note the position of the drift mark. When calibrating the low current of a double-current exposure, make sure DRIFT scans the same drift mark as the high-current condition file.
* Read the subsection on DRIFT subprogram if you wish to use a global mark as DRIFT mark (recommended in certain cases)
=== Execute HEIMAP ===
*Click 'HEIMAP' and 'Edit parameters'.
*In the HEIMAP window, you should type in the correct substrate type and workpiece window.
*Measure 5 x 5 points in X and Y
* Adjust the pitch (µm) of the 5 points in X and Y to cover the entire pattern on your substrate.
* Click ecxecute. Repeat HEIMAP for all substrates on stage (e.g. 4A and 4B)
* click 'Cancel' when HEIMAP have been executed on all substrates
=== Execute SETWFR and CHIPAL ===
If you have alignment of your pattern to an existing pattern on your substrate. Read more about SETWFR and CHIPAL in the subsections below.
=== Execute SAVE ===
* Click 'SAVE' and 'Edit parameters'
* In the SAVE window, click 'Acquisition of latest status' and (after the parameters appear in the window) click 'Apply/Save'. Note in the status line that the condition file has been saved.
== Detailed descriptions of subprograms ==


=== SFOCUS ===
=== SFOCUS ===