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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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Undo revision 19396 by Lynhen (talk)
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|style="background:LightGrey; color:black"|Seed metal
|style="background:LightGrey; color:black"|Seed metal
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
NiV is most commonly used.
NiV.
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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| style="background:LightGrey; color:black"|Forbidden materials
| style="background:LightGrey; color:black"|Forbidden materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Ask Danchip for details
Ask Danchip for details|}
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