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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b>
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!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Electrochemical deposition of nickel
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
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{| border="2" cellspacing="0" cellpadding="2"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Electrochemical deposition of nickel
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Thickness
|style="background:WhiteSmoke; color:black"|
0 - 1400 µm
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|style="background:LightGrey; color:black"|Uniformity
|style="background:WhiteSmoke; color:black"|
Around 10% (depending on sample and process)
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black"|
52*C
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|style="background:LightGrey; color:black"|pH
|style="background:WhiteSmoke; color:black"|
3,5 - 4,0 (3,5 - 3,8 recommended by manufacturer)
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*<nowiki>#</nowiki> 1 x 50 mm wafer
*<nowiki>#</nowiki> 1 x 100 mm wafer
*<nowiki>#</nowiki> 1 x 150 mm wafer
*Maximum sample thickness: 1,0 mm
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| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*Most materials '''except copper and cobalt'''.
*Ask Danchip for details.
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