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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>Electroplating-Ni</b>
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Electrochemical deposition of nickel
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Parameter  
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| style="background:LightGrey; color:black"|Forbidden materials
| style="background:LightGrey; color:black"|Forbidden materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Copper, cobalt. See machine manual on LabManager for details
Ask Customer Support for details
|}
|}
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