Specific Process Knowledge/Lithography/EBeamLithographyManual: Difference between revisions
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== Rough estimation of exposure time == | == Rough estimation of exposure time == | ||
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Based on the equations above, a rough estimate of the exposure time is easily calcualted. In the second sheet of the e-beam logbook, a simple program for calculating the scan speed frequency and an estimation of the exposure time can be found. Note, that the actual writing time will exceed the exposure-time, as the exposure-time calculation doesn’t include pre-calibrations and stage movement during exposure. | Based on the equations above, a rough estimate of the exposure time is easily calcualted. In the second sheet of the e-beam logbook, a simple program for calculating the scan speed frequency and an estimation of the exposure time can be found. Note, that the actual writing time will exceed the exposure-time, as the exposure-time calculation doesn’t include pre-calibrations and stage movement during exposure. | ||
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The machine has a number of objective apertures (no. 15 on above illustration) in order to obtain different beam diameters in different current ranges. The available apertures are: | The machine has a number of objective apertures (no. 15 on above illustration of the column) in order to obtain different beam diameters in different current ranges. The available apertures are: | ||
The beam diameter changes as a function of aperture size and beam current. | The beam diameter changes as a function of aperture size and beam current. | ||
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= Mounting of chips or wafers into cassette = | = Mounting of chips or wafers into cassette = | ||