Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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|[[File:IMG_6438.jpg|150px]] [[File:IMG_6439.jpg|150px]] | |[[File:IMG_6438.jpg|150px]] [[File:IMG_6439.jpg|150px]] | ||
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| chip Al/Cu cassette || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | | chip Al/Cu cassette with slot widths of 20 mm, 12 mm, 8 mm and 4 mm || 2" Ti cassette; wafer orientation is flat-down || 2" Al cassette; wafer orientation is flat-up || 4" Ti cassette; wafer orientation is flat-down || 4" Al cassette; wafer orientation is flat-down | ||
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