Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and re-load an '''empty''' cassette into the autoloader. | After your exposure, fully trained users can unload their cassettes from the autoloader, unmount their substrates and re-load an '''empty''' cassette into the autoloader. | ||
If you are unable to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates. | If you are unable to unmount your substrates before another user requires the cassette, you must accept that either the next user or DTU Danchip personel unmount your substrates. | ||
= E-beam resists and Process Flows = | = E-beam resists and Process Flows = | ||