Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

@@ Line 308: / Line 308: @@
 {| cellpadding="2" style="border: 2px solid darkgray;" align="right"
-! width="350" |
+! width="200" |
-! width="150" |
+! width="200" |
-! width="150" |
+! width="200" |
-! width="250" |
+! width="200" |
 ! width="200" |
 |- border="0"
-| [[File:IMG_6433.jpg|150px]][[File:IMG_6434.jpg|150px]]
+| [[File:IMG_6440.jpg|150px]] [[File:IMG_6441.jpg|150px]]
-|
+| [[File:IMG_6433.jpg|150px]]  [[File:IMG_6434.jpg|150px]]
-|
+| [[File:IMG_6436.jpg|400px]] [[File:IMG_6437.jpg|400px]]
-|
+| [[File:IMG_6436.jpg|400px]] [[File:IMG_6437.jpg|400px]]
 |- align="center"
-| 2" Ti cassette; wafers are mounted flat-up || 2" Al cassette; wafers are mounted flat-down || 4" Ti cassette || 42 Al cassette
+| 2" Ti cassette; wafers are mounted flat-up || 2" Al cassette; wafers are mounted flat-down || 4" Ti cassette; wafers are mounted flat-down || 4" Al cassette; wafers are mounted flat-down
 |}