Specific Process Knowledge/Lithography/EBeamLithography/FilePreparation: Difference between revisions
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[[File:CHIPAL.jpg|600px]] | [[File:CHIPAL.jpg|600px]] | ||
The global- and chip-mark position, size and orientation should be specified in the jdf-file: | |||
<pre> | |||
______________________________________________________________ | |||
JOB/W 'ALIGN',4 4" wafer, jobname is 'SIMPLE' | |||
GLMPOS P=(-7980,180),Q=(7960,-180) Position of P and Q mark | |||
GLMP 4.0,1000.0,t,f see note 1 | |||
PATH FT01 use FT01 when aligning, sec. 3.3 | |||
ARRAY (0,1,1000)/(0,1,1000) 1 chip starting in (0,0) is written | |||
CHMPOS M1=(-350,350),M2=(350,350), Chipmark pos. in chip coordinate sys. | |||
M3=(350,-350),M4=(-350,-350) | |||
CHMARK 4.0,15.0, t, f see note 1 | |||
ASSIGN P(1) -> (*,*) All chips are assigned to pattern 1 | |||
AEND End-command to 'ARRAY' | |||
PEND End-command to 'PATH' | |||
LAYER 1 Layer 1 in the v30 file is written | |||
P(1) 'align.v30' Pattern 1 defined in 'align.v30' | |||
SPPRM 4.0,,,,1.0,1 Beam parameters (see section 6.2) | |||
STDCUR 0.22 ;nA Beam current (nA), se note 2. | |||
END End of jdf-file | |||
_______________________________________________________________ | |||
</pre> | |||
note 1: Width, length, type and orientation of global marks (GLMP) or chipmarks (CHMARK); the settings of the parameters t (type) and f (orientation) are listed in the two tables below: | |||