Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions

From LabAdviser
BGE (talk | contribs)
No edit summary
BGE (talk | contribs)
No edit summary
Line 42: Line 42:
|'''Batch size'''
|'''Batch size'''
|
|
1-19/25  4" wafers or 5 masks at a time  
1-19/25  4" wafers or 4 masks at a time  
|
|
1-5 4" wafer at a time
1-5 4" wafer at a time
Line 54: Line 54:
|}
|}


[[Image:7-up_RR4.JPG|300x300px|right|thumb|7-up in cleanroom 4]]
[[Image:7-up_6inch.jpg|300x300px|right|thumb|7-up 6" in cleanroom 4. <br\> -Up to 25 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi]]
[[Image:7-up_Mask.jpg|300x300px|right|thumb|7-up for masks and glass wafers positioned in cleanroom 4:<br\> -Up to 25 wafers of 4" at a time or 4 masks.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi, glass, chromium]]

Revision as of 13:11, 21 February 2008

Cleaning of wafers or masks

7-up 4": positioned in cleanroom 3<br\> -Up to 19 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi

Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fumehood in a beaker "Piranha" Both 7-up and Piranha removes heavy organics. Always use one of these after KOH to remove alkali ions before further processing. 7-up and Piranha are also used as cleaning solutions after stripping resist.


Comparing data for 7-up and Piranha

7-up Piranha
General description

Cleaning of wafers or masks using the dedicated tanks. There are one tank for masks and glasswafers and one for 4-6" Si wafers in cleanroom 4 and one tank in cleanroom 3 for 4" Si wafers only.

Cleaning of wafers using a beaker in the fumehood in cleanroom 2.Used for glass wafers or wafers with metal or other materials that you are not allowed to put in the 7-up for wafers.

Chemical solution 98% Sulfuricacid and Ammoniumsulfat 98% Sulfuricacid and Hydrogenperoxide 4:1 add HO to HSO
Process temperature 80 oC ~70 oC the chemicals will heat up to working temperature during mixing, therefore be carefull!
Process time

10 min.

10 min.

Allowed materials

Dependent on which bath is used, look at the text in the pictures.

All materials (in beaker).

Batch size

1-19/25 4" wafers or 4 masks at a time

1-5 4" wafer at a time

Size of substrate

4-6" wafers

2-4" wafers

7-up 6" in cleanroom 4. <br\> -Up to 25 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi
7-up for masks and glass wafers positioned in cleanroom 4:<br\> -Up to 25 wafers of 4" at a time or 4 masks.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi, glass, chromium